XCZU5EV-L2FBVB900E
- Mfr.Part #
- XCZU5EV-L2FBVB900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 900FCBGA
- Stock
- 21,584
- In Stock :
- 21,584
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Series :
- Zynq® UltraScale+™ MPSoC EV
- Package / Case :
- 900-BBGA, FCBGA
- Packaging :
- Tray
- Surface Mount :
- yes
- Terminal Position :
- BOTTOM
- Speed :
- 533MHz, 600MHz, 1.3GHz
- Supply Voltage :
- 0.72V
- Operating Temperature :
- 0°C~100°C TJ
- Architecture :
- MCU, FPGA
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Factory Lead Time :
- 11 Weeks
- RAM Size :
- 256KB
- RoHS Status :
- ROHS3 Compliant
- Peripherals :
- DMA, WDT
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Supply Voltage-Max (Vsup) :
- 0.742V
- Number of Terminations :
- 900
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of I/O :
- 204
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
- HTS Code :
- 8542.31.00.01
- JESD-30 Code :
- R-PBGA-B900
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Published :
- 2016
- Supply Voltage-Min (Vsup) :
- 0.698V
- Datasheets
- XCZU5EV-L2FBVB900E

900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EV series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.For safe operation, it is advisable to utilize a power supply with 0.72V voltage.In the SoCs wireless, high voltages above 0.742V are considered dangerous and should not be used.In order to run it, it must be fed by at least 0.698V of power.The system on a chip uses 900 terminations in total.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Furthermore, this SoC processor also incorporates additional features similar to ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY which are available on other SoC processors also.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5EV-L2FBVB900E System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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