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    Mfr.Part #
    XCZU6EG-3FFVB1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    38,099
    In Stock ：
    38,099

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Factory Lead Time :
    11 Weeks
    Number of I/O :
    328
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Package / Case :
    1156-BBGA, FCBGA
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Packaging :
    Tray
    RoHS Status :
    ROHS3 Compliant
    RAM Size :
    256KB
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Published :
    2016
    Architecture :
    MCU, FPGA
    Series :
    Zynq® UltraScale+™ MPSoC EG
    HTS Code :
    8542.31.00.01
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Peripherals :
    DMA, WDT
    Operating Temperature :
    0°C~100°C TJ
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed :
    600MHz, 1.5GHz
    Introducing System On Chip (SoC) AMD Xilinx XCZU6EG-3FFVB1156E from Xinshop,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU6EG-3FFVB1156E pinout, XCZU6EG-3FFVB1156E datasheet PDF, XCZU6EG-3FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6EG-3FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6EG-3FFVB1156E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 328 I/Os.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU6EG-3FFVB1156E System On Chip (SoC) applications.


    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
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