XCZU7EG-L2FBVB900E

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Mfr.Part #
XCZU7EG-L2FBVB900E
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
42,214
In Stock :
42,214

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Min (Vsup) :
0.698V
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Speed :
533MHz, 600MHz, 1.3GHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Supply Voltage-Max (Vsup) :
0.742V
RoHS Status :
ROHS3 Compliant
Peripherals :
DMA, WDT
Number of I/O :
204
Surface Mount :
yes
RAM Size :
256KB
Series :
Zynq® UltraScale+™ MPSoC EG
HTS Code :
8542.31.00.01
JESD-30 Code :
R-PBGA-B900
Primary Attributes :
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Supply Voltage :
0.72V
Terminal Position :
BOTTOM
Architecture :
MCU, FPGA
Terminal Form :
Ball
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Number of Terminations :
900
Published :
2016
Packaging :
Tray
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case :
900-BBGA, FCBGA
Operating Temperature :
0°C~100°C TJ
Introducing System On Chip (SoC) AMD Xilinx XCZU7EG-L2FBVB900E from Xinshop,where excellence meets affordability. This product stands out with its Number of Terminations:900, Package / Case:900-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCZU7EG-L2FBVB900E pinout, XCZU7EG-L2FBVB900E datasheet PDF, XCZU7EG-L2FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU7EG-L2FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU7EG-L2FBVB900E


900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 204 I/Os.It is recommended to use a 0.72V power supply.In the SoCs wireless, voltages above 0.742V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.698V.In total, there are 900 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU7EG-L2FBVB900E System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
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