XCZU7EG-L2FBVB900E
- Mfr.Part #
- XCZU7EG-L2FBVB900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 900FCBGA
- Stock
- 42,214
- In Stock :
- 42,214
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Supply Voltage-Min (Vsup) :
- 0.698V
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Speed :
- 533MHz, 600MHz, 1.3GHz
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Supply Voltage-Max (Vsup) :
- 0.742V
- RoHS Status :
- ROHS3 Compliant
- Peripherals :
- DMA, WDT
- Number of I/O :
- 204
- Surface Mount :
- yes
- RAM Size :
- 256KB
- Series :
- Zynq® UltraScale+™ MPSoC EG
- HTS Code :
- 8542.31.00.01
- JESD-30 Code :
- R-PBGA-B900
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
- Supply Voltage :
- 0.72V
- Terminal Position :
- BOTTOM
- Architecture :
- MCU, FPGA
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Factory Lead Time :
- 11 Weeks
- Number of Terminations :
- 900
- Published :
- 2016
- Packaging :
- Tray
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Package / Case :
- 900-BBGA, FCBGA
- Operating Temperature :
- 0°C~100°C TJ
- Datasheets
- XCZU7EG-L2FBVB900E
900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
On this SoC, there is Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq® UltraScale+™ MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 204 I/Os.It is recommended to use a 0.72V power supply.In the SoCs wireless, voltages above 0.742V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.698V.In total, there are 900 terminations, which is great for system on a chip.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU7EG-L2FBVB900E System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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