X66AK2H12AAWA24
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- Mfr.Part #
- X66AK2H12AAWA24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 23,425
- In Stock ：
- 23,425
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Supply Voltage :
- 1V
- Height :
- 800μm
- Speed :
- 1400 MHz
- Terminal Form :
- Ball
- Type :
- DSP+ARM®
- Pbfree Code :
- No
- Packaging :
- Tray
- Base Part Number :
- 66AK2H12
- Terminal Pitch :
- 1mm
- Length :
- 38mm
- RAM Size :
- 32kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Low Power Mode :
- yes
- Min Supply Voltage :
- 800mV
- Memory Size :
- 4MB
- Number of I/O :
- 32
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- On Chip Data RAM :
- 12.75MB
- Boundary Scan :
- yes
- Core Architecture :
- ARM
- Non-Volatile Memory :
- ROM (384kB)
- Frequency :
- 1.4GHz
- Voltage - Core :
- Variable
- Series :
- 66AK2Hx KeyStone Multicore
- Format :
- Floating Point
- Number of Timers/Counters :
- 20
- JESD-30 Code :
- S-PBGA-B1517
- Package / Case :
- 1517-BBGA, FCBGA
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~100°C TC
- Max Supply Voltage :
- 1.1V
- Width :
- 38mm
- Integrated Cache :
- yes
- ECCN Code :
- 3A001.A.3
- Lead Free :
- Contains Lead
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- HTS Code :
- 8542.31.00.01
- Datasheets
- X66AK2H12AAWA24
DSP Texas Instruments X66AK2H12AAWA24 Overview
The DSP Texas Instruments X66AK2H12AAWA24 is a state-of-the-art digital signal processor (DSP) that integrates advanced ARM architecture and SOC capabilities into a compact BGA package. Designed to handle complex signal processing tasks with high efficiency, this product by Texas Instruments excels in applications requiring rapid data processing and real-time analytics. Its robust design and scalability make it an ideal choice for industries looking to enhance technological applications while maintaining power efficiency and high performance.
X66AK2H12AAWA24 Features
This integrated circuit boasts several key features, including its high-performance ARM processor, which supports complex algorithm computations necessary for advanced signal processing. Additionally, the SOC integration facilitates seamless communication and functionality within embedded systems. The compact BGA packaging not only ensures a reduced footprint but also enhances thermal management and reliability in demanding environments.
X66AK2H12AAWA24 Applications
- Automotive Advanced Driver Assistance Systems (ADAS): Utilizes its signal processing capabilities to interpret sensor data, aiding in real-time decision-making for safety and navigation.
- Telecommunications Infrastructure: Supports the processing demands of telecommunications equipment, optimizing data flow and signal integrity across networks.
- Medical Imaging Systems: Enhances imaging technologies such as MRI and ultrasound by processing complex visuals quickly, improving diagnostic capabilities.
- Consumer Electronics: Applied in devices like digital cameras and smartphones, improving image and audio processing functionalities.
- Industrial Automation: Critical in the management of machinery and production processes, ensuring operational efficiency through precise control and monitoring systems.
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