XC17S100APD8C
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- Mfr.Part #
- XC17S100APD8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 100000 C-TEMP 8-DIP
- Stock
- 24,913
- In Stock ：
- 24,913
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Base Part Number :
- XC17S100A
- Programmable Type :
- OTP
- Memory Width :
- 1
- Published :
- 1999
- Operating Supply Voltage :
- 3.3V
- Packaging :
- Tube
- Pin Count :
- 8
- I/O Type :
- COMMON
- Height Seated (Max) :
- 4.5974mm
- Length :
- 9.3599mm
- ECCN Code :
- EAR99
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Density :
- 1 Mb
- Parallel/Serial :
- Serial
- Number of Pins :
- 8
- Peak Reflow Temperature (Cel) :
- 225
- Number of Functions :
- 1
- Lead Free :
- Contains Lead
- Supply Voltage-Min (Vsup) :
- 3V
- Width :
- 7.62mm
- Pbfree Code :
- No
- JESD-609 Code :
- e0
- Mounting Type :
- Through Hole
- Radiation Hardening :
- No
- Supply Current-Max :
- 0.015mA
- Terminal Pitch :
- 2.54mm
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Position :
- Dual
- Surface Mount :
- No
- Memory IC Type :
- CONFIGURATION MEMORY
- Output Characteristics :
- 3-STATE
- Number of Terminations :
- 8
- Operating Temperature :
- 0°C~70°C
- Supply Voltage :
- 3.3V
- RoHS Status :
- Non-RoHS Compliant
- Standby Current-Max :
- 0.001A
- Voltage - Supply :
- 3V~3.6V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Datasheets
- XC17S100APD8C
[Configuration Proms for FPGAs AMD Xilinx XC17S100APD8C] Overview
Introducing the XC17S100APD8C, a cutting-edge integrated circuit PROM meticulously crafted by AMD Xilinx. This high-quality IC PROM serves as the cornerstone for seamless configuration of Field-Programmable Gate Arrays (FPGAs). Designed to meet the demands of modern industrial applications, it offers a colossal capacity of 100,000 CTEMP, ensuring optimal performance even under extreme temperature conditions.
Engineered with precision and reliability in mind, this AMD Xilinx marvel comes in a compact 8DIP package, facilitating hassle-free integration into diverse electronic systems. From intricate hardware configurations to robust firmware implementations, the XC17S100APD8C empowers engineers with unparalleled flexibility and efficiency, making it the preferred choice for discerning B2B clients worldwide.
XC17S100APD8C Features
- High-capacity IC PROM designed for FPGA configuration
- Impressive storage capacity of 100,000 CTEMP
- Robust construction ensures reliability in extreme temperature conditions
- Compact 8DIP package for easy integration
- Engineered by AMD Xilinx for superior performance and longevity
XC17S100APD8C Applications
- FPGA Configuration: Seamlessly integrates into FPGA-based systems, facilitating rapid configuration and reconfiguration for diverse applications such as telecommunications, aerospace, and automotive.
- Embedded Systems: Enhances the functionality of embedded systems by providing reliable and efficient configuration storage, ideal for industrial automation, IoT devices, and embedded computing platforms.
- Hardware Prototyping: Accelerates the prototyping process for hardware designers, enabling quick and easy configuration testing in prototyping environments, thereby expediting product development cycles.
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Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
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