XC17S200APDG8C
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- Mfr.Part #
- XC17S200APDG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER 200K C-TEMP 8-DIP
- Stock
- 53
- In Stock ：
- 53
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Supply Voltage-Max (Vsup) :
- 3.6V
- Pbfree Code :
- yes
- Parallel/Serial :
- Serial
- Terminal Finish :
- Matte Tin (Sn)
- Published :
- 1999
- I/O Type :
- COMMON
- Supply Current-Max :
- 0.015mA
- Operating Temperature :
- 0°C~70°C
- ECCN Code :
- EAR99
- Memory Width :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Width :
- 7.62mm
- Output Characteristics :
- 3-STATE
- Supply Voltage-Min (Vsup) :
- 3V
- Standby Current-Max :
- 0.001A
- Radiation Hardening :
- No
- Memory Size :
- 2MB
- JESD-609 Code :
- e3
- Supply Voltage :
- 3.3V
- Height Seated (Max) :
- 4.5974mm
- Memory IC Type :
- CONFIGURATION MEMORY
- Programmable Type :
- OTP
- Pin Count :
- 8
- Base Part Number :
- XC17S200A
- Mounting Type :
- Through Hole
- Surface Mount :
- No
- Packaging :
- Tube
- Operating Supply Voltage :
- 3.3V
- Terminal Pitch :
- 2.54mm
- Peak Reflow Temperature (Cel) :
- 250
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Terminal Position :
- Dual
- RoHS Status :
- RoHS Compliant
- Number of Terminations :
- 8
- Number of Functions :
- 1
- Voltage - Supply :
- 3V~3.6V
- Number of Pins :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Length :
- 9.3599mm
- Datasheets
- XC17S200APDG8C
Configuration Proms for FPGAs - AMD Xilinx XC17S200APDG8C Overview
Introducing the XC17S200APDG8C from AMD Xilinx, a versatile and reliable integrated circuit tailored for FPGA configuration. This innovative IC PROM SER 200K CTEMP 8DIP offers unparalleled performance and efficiency, making it an ideal choice for various industrial applications. With its advanced features and robust design, this component sets a new standard in FPGA configuration technology.
XC17S200APDG8C Features
- High-capacity PROM: The XC17S200APDG8C features a generous 200K serial PROM, providing ample storage for FPGA configuration data.
- Wide temperature range: Designed to withstand extreme operating conditions, this IC is capable of operating across a wide temperature range, ensuring reliability in diverse environments.
- DIP package: With its convenient 8DIP package, the XC17S200APDG8C offers easy integration into existing circuit designs, simplifying installation and assembly processes.
- Fast serial programming: Equipped with efficient serial programming capabilities, this component enables swift and seamless configuration of FPGAs, minimizing downtime and enhancing productivity.
- Low power consumption: Despite its high performance, the XC17S200APDG8C maintains low power consumption, optimizing energy efficiency and reducing operational costs.
- Robust construction: Built to meet rigorous quality standards, this IC boasts a durable construction that ensures long-term reliability and stability in demanding industrial environments.
XC17S200APDG8C Applications
- FPGA Configuration: The XC17S200APDG8C is specifically designed for programming field-programmable gate arrays (FPGAs), facilitating seamless configuration updates and modifications. Its high-capacity PROM and fast serial programming capabilities make it an indispensable tool for FPGA-based systems in various industries, including telecommunications, aerospace, and automotive.
- Embedded Systems: Leveraging its wide temperature range and low power consumption, this IC is well-suited for embedded systems requiring reliable performance in harsh operating environments. From industrial control systems to IoT devices, the XC17S200APDG8C enhances the functionality and efficiency of embedded applications.
- Data Communication: In data communication equipment such as routers, switches, and network appliances, the XC17S200APDG8C plays a vital role in FPGA configuration, ensuring seamless data processing and transmission. Its robust design and efficient programming capabilities contribute to the overall reliability and performance of communication infrastructure.
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