XC17S30VO8C

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Mfr.Part #
XC17S30VO8C
Manufacturer
AMD Xilinx
Package / Case
8-SOIC (0.154, 3.90mm Width)
Datasheet
Download
Description
IC PROM SER 300K 8-SOIC
Stock
9,083
In Stock :
9,083

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Manufacturer :
AMD Xilinx
Product Category :
Configuration Proms for FPGAs
Memory Size :
300kb
Length :
4.9mm
Power Supplies :
5V
Peak Reflow Temperature (Cel) :
225
Base Part Number :
XC17S30
Qualification Status :
Not Qualified
Output Characteristics :
3-STATE
JESD-609 Code :
e0
I/O Type :
COMMON
Width :
3.9mm
RoHS Status :
Non-RoHS Compliant
Lead Free :
Contains Lead
Time@Peak Reflow Temperature-Max (s) :
30
Reach Compliance Code :
not_compliant
Pbfree Code :
No
Packaging :
Tube
Memory IC Type :
MEMORY CIRCUIT
Supply Voltage :
5V
Number of Terminations :
8
Operating Mode :
SYNCHRONOUS
Height Seated (Max) :
1.2mm
Programmable Type :
OTP
Surface Mount :
yes
Mounting Type :
Surface Mount
Standby Current-Max :
0.00005A
Voltage - Supply :
4.75V~5.25V
Terminal Position :
Dual
Package / Case :
8-SOIC (0.154, 3.90mm Width)
Operating Temperature :
0°C~70°C
Pin Count :
8
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Supply Voltage-Min (Vsup) :
4.75V
Supply Voltage-Max (Vsup) :
5.25V
ECCN Code :
EAR99
Clock Frequency :
10MHz
Number of Functions :
1
Terminal Pitch :
1.27mm
Memory Width :
1
Published :
1999
Terminal Form :
Gull wing
Number of Pins :
8
Supply Current-Max :
0.01mA
Datasheets
XC17S30VO8C
Introducing Configuration Proms for FPGAs AMD Xilinx XC17S30VO8C from Xinshop,where excellence meets affordability. This product stands out with its Base Part Number:XC17S30, Number of Terminations:8, Mounting Type:Surface Mount, Package / Case:8-SOIC (0.154, 3.90mm Width), Operating Temperature:0°C~70°C, Number of Pins:8, XC17S30VO8C pinout, XC17S30VO8C datasheet PDF, XC17S30VO8C amp .Beyond Configuration Proms for FPGAs AMD Xilinx XC17S30VO8C ,we also offer AT17LV128-10SI, EPCV4SI8N, XC17S150XLSO20C, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC17S30VO8C


[Configuration Proms for FPGAs] Overview

欢迎您了解来自AMD Xilinx的XC17S30VO8C配置PROM。这款产品是一款专为现代FPGA(现场可编程门阵列)设计的集成电路芯片,旨在提供可靠的配置存储解决方案。XC17S30VO8C采用了先进的技术,可实现高达300,000位的存储容量,并以8SOIC封装形式提供。无论您是在开发新的电子产品还是在维护现有系统,XC17S30VO8C都能为您提供可靠、灵活的配置解决方案。

XC17S30VO8C Features

  • 高容量存储:XC17S30VO8C提供高达300,000位的存储容量,满足各种FPGA配置需求。
  • 可靠性:作为AMD Xilinx的产品,XC17S30VO8C具有卓越的可靠性和稳定性,确保您的系统配置始终安全可靠。
  • 适用于各种应用:XC17S30VO8C适用于广泛的应用领域,包括工业控制、通信设备、医疗设备等。
  • 紧凑封装:采用8SOIC封装,XC17S30VO8C易于集成到各种电路板设计中,节省空间,提高系统性能。
  • 低功耗设计:XC17S30VO8C采用低功耗设计,可帮助您优化系统能效,延长电池寿命。

XC17S30VO8C Applications

  • 工业控制:XC17S30VO8C可用于工业控制系统的FPGA配置存储,确保系统稳定运行。
  • 通信设备:在通信设备中,XC17S30VO8C可用于配置FPGA,实现各种信号处理和通信协议支持。
  • 医疗设备:XC17S30VO8C可应用于医疗设备中,用于配置FPGA,实现医疗图像处理、数据采集等功能。
  • 航天航空:在航天航空领域,XC17S30VO8C可用于FPGA的配置存储,确保航天器和飞行器系统的可靠性和稳定性。
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Shipping Method

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Shipping Cost

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