Here are the following introduction to the advantages of IRFZ44NL: Advanced processing techniques to achieve, extremely low on-resistance per silicon area. This benefit,combined with the fast switching speed and ruggedizedDevicedesign, provides the designer with an extremely efficient andreliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable ofaccommodating diesizes upto HEX-4. Itprovides thehighestpower capability and the lowest possible on-resistance inany existing surface mount package. The D2Pak is suitablefor high current applications because of its low internal!Connection resistance and can dissipate up to 2.0W in atypical surface mount application.
Catalog
IRFZ44NL Overview
IRFZ44NL Pinout
IRFZ44NL CAD Model
IRFZ44NL Features
IRFZ44NL Advantages
IRFZ44NL Alternatives
IRFZ44NL Package
IRFZ44NL Typical Application Circuit
Datasheet PDF
Specifications
Parts with Similar Specs
IRFZ44NL Overview
A TO-262-packaged 55V single N-Channel power MOSFET
Advanced Process Technology
Surface Mount (IRFZ44NS)
Low-profilethrough-hole (IRFZ44NL)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Lead-Free
IRFZ44NLPinout
IRFZ44NL CAD Model
Symbol
Footprint
3D-model
IRFZ44NLFeatures
Optimized for greatest availability from distribution partners,
planar cell shape for wide SOA
JEDEC-compliant product qualification
Through-hole power package industry standard
High-current rating
IRFZ44NLAdvantages
Greater toughness
Standard pinout permits drop-in replacement
Wide availability from distribution partners
Industry qualification level
High carrying capacity for current
IRFZ44NLAlternatives
IRFZ44NS is the replacement. The difference between is they have different features: IRFZ44NS features Surface Mount (IRFZ44NS), while Low-profile through-hole is (IRFZ44NL)’s characteristic. The through-hole version (IRFZ44NL) is suitable for low-profile applications.
IRFZ44NLPackage
IRFZ44NLTypical Application Circuit
Datasheet PDF
Please DOWNLOAD datasheets and manufacturer documentation for IRFZ44NL.
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Here are the following introduction to the advantages of IRFZ44NL: Advanced processing techniques to achieve,extremely low on-resistance per silicon area. This benefit,combined with the fast switching speed and ruggedized Device design,provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
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